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CMP an Planarization

E400 E Planariztion system

E400 E - CMP and Planarization tool

The E400 is designed for polishing and planarization of single wafers with diameters between 1″ and 4″. The optimal use of E400 is in the field of research and development application as well as small scale production requirements due to the machine’s flexibility.

E460 E Planariztion system

E460 E - CMP and Planarization tool

The E460 is designed for polishing and planarization of single wafers with diameters between 1″ and 8″. The optimal use of E460 is in the field of research and development application as well as small scale production requirements due to the machine’s flexibility.