Combination of High Power and Low Power process and Cross-sectioning Process can be selected for various kinds of purposes. Laser Power 10W type (PL101_10i, PL121i) can cut the IC package substrates, the IC package covered by ceramic or the IC package covered by metal lid, and BGA package in short time.
This model type is effective for Power Module and IGBT used on Hybrid Car, Electric Car, Photovoltaic Generation and so on.
“I” serie
Laser IC Opener “i” series are able to decap Cu wire IC and also perform decapsulation on ultra small packages in constant pursue for improvement in usability. This system can decap a 0.5mm size package.
Advanced High-Zoom Function
Highly accurate area setting with 2x, 3x of 2 step zoom in and 1/2, 1/3 of 2 step zoom out by digital zoom. Highly precision and accurate processing for package smaller than 1x1mm.
High Clarity Image
High resolution Camera (5Mega-pixel) with 25mm lens (35mm lens is optional). Lighting in the chamber has been newly enhanced for greater capability in capturing critical details more clearly.
Automated Hight Measurement Function
It can measure the decapping thickness by a dedicated measuring laser. Concurrently, stage advances up and down as it process while keeping constant focal length, unavailable in conventional system. An auto stop function can stop at any desired height where value of decapping height can be input in advance. This can prevent damage to the die with high accuracy.
Absorption Nozzle
Additional absorption nozzle near the stage will suck the dust during decapping. Absorption becomes highly effectively in keeping the cleanliness of IC and system