PVD systems

COVAP PVD PLATFORM

A compact, economical solution suitable for many process applications, the small size of the Covap II will ensure you can find space in your lab and in your budget.  Approximate substrate maximum: 75mm x 75mm.

Process:
resistive thermal evaporation

NEXDEP PVD PLATFORM

Incredible versatility with a compact footprint.  Myriad process applications and tools available, while remaining within budget.  It’s the perfect system for smaller substrates involved in the most advanced, recipe driven work. Approximate substrate maximum: 100mm x 100mm.

Process capabilities:

• resistive thermal evaporation
• sputter deposition
• electron beam evaporation
• ion assisted deposition
• custom available

AMOD PVD PLATFORM

Offering a chamber size larger than our Nexdep but smaller than our Evovac, the Amod offers a great balance between capability and budget.  Approximate substrate maximum: 150mm x 150mm.

EVOVAC PVD PLATFORM

Our most capable PVD platform provides the largest chamber for multiple deposition sources, and the most modifiable process tools to ensure your specific research needs are being met precisely.  It’s the perfect tool for complex recipes that demand multiple sources and advanced deposition techniques.  Approximate substrate maximum: 150mm x 150mm.
Offering a chamber size larger than our Nexdep but smaller than our Evovac, the Amod offers a great balance between capability and budget.  Approximate substrate maximum: 150mm x 150mm.

Box Coaters PVD platform

Large box chambers are perfect for depositing onto large area substrates or batches of many smaller substrates. The increased height of these chambers provides excellent film thickness uniformity, while increases to the width and depth provide space for advanced fixturing options. All box coater system configurations are computer modeled to optimize film uniformity, material yield, and throughput.

Process capabilities:

• resistive thermal evaporation
• sputter deposition
• electron beam evaporation
• ion assisted deposition
• custom available

NEBULA Cluster platform

Angstrom’s pinnacle of automation, engineering precision, user control, and collaboration with you, our partner. These Nebula Cluster integrated vacuum systems are designed specifically to meet our clients process requirements. The number and type of vacuum modules are customer selected and provide room for future expansion potential.

• Glove box
• Cassette station (up to 25 wafers)
• Vacuum load lock
• Wafesr up to 200х200 mm, к
• Processes: PVD, LPCVD, ALD, RIE or ICP-RIE, PECVD or ICPECVD

Processes:

Reticle (IBSD) - Ion beam sputter deposition system from Angstrom Engineering Inc. (Канада).

The ion beam sputter deposition system creates precise optical films of the highest purity, density, and stability. Angstrom Engineering’s Reticle system provides a turn-key solution for those looking to realize any optical design into a high-performance film.

Process:
IBSD (Ion beam sputter deposition)