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Atomic Layer Deposition Systems (ALD)

SILAYO - PEALD for optical coatings

SILAYO ICP-ALD from SENTECH Instruments GmbH for optical coatings.

PEALD for best thin film uniformity < 1 %

SILAYO is designed for conformal and homogeneous optical coatings on large 3D objects and on batches of small substrates. The SENTECH proprietary Planar Triple Spiral Antenna (PTSA) provides a homogeneous plasma for homogeneous optical coatings.

Wafrrs up to 330 mm in dia and up to 100 mm height
Process temperature: up to 400 oC
ICP (PTSA) power sourse - inductive couples plasma
Vacuum load-lock
Process: ALD (ICP-ALD)
SENTECH Software
ALD real time monitor (in-situ) tress control
Glove boxintegration

Application: optica films: Al2O3, SiO2, TiO2, HfO2, TaO2, ZrO, Nb2O5

SILAYO ICP-ALD from SENTECH Instruments GmbH for optical coatings.

PEALD for best thin film uniformity < 1 %

SILAYO is designed for conformal and homogeneous optical coatings on large 3D objects and on batches of small substrates. The SENTECH proprietary Planar Triple Spiral Antenna (PTSA) provides a homogeneous plasma for homogeneous optical coatings.

Wafrrs up to 330 mm in dia and up to 100 mm height
Process temperature: up to 400 oC
ICP (PTSA) power sourse - inductive couples plasma
Vacuum load-lock
Process: ALD (ICP-ALD)
SENTECH Software
ALD real time monitor (in-situ) tress control
Glove boxintegration

Application: optica films: Al2O3, SiO2, TiO2, HfO2, TaO2, ZrO, Nb2O5

SI ALD и SI ALD LL (Thermal ALD and PEALD)

SI ALD и SI ALD LL for atomic layer deposition (Thermal ALD и PEALD) from SENTECH Instruments GmbH without or with load lock. 

SENTECH atomic layer deposition systems enable thermal and plasma enhanced operation. The ALD systems can be configured for oxide, nitride, and metal deposition. 3D structures can be homogenously and conformally coated. With ALD, PECVD and ICPECVD, SENTECH offers plasma deposition technology for depositing films from the nanometer scale up to several microns.
Wafers up to 200 mm.

Process temperture: up to 500 oC
PE power sourse for low temperature deposition (option - PEALD) 
Vacuum loak-lock (for SI ALD LL)
Process: Thermal ALD (Thermal ALD) and plasma ALD (PEALD)
SENTECH Software
ALD real time monitor
in-situ ellipsometer 
Cluster configuration
Glove box integration

SI ALD и SI ALD LL for atomic layer deposition (Thermal ALD и PEALD) from SENTECH Instruments GmbH without or with load lock. 

SENTECH atomic layer deposition systems enable thermal and plasma enhanced operation. The ALD systems can be configured for oxide, nitride, and metal deposition. 3D structures can be homogenously and conformally coated. With ALD, PECVD and ICPECVD, SENTECH offers plasma deposition technology for depositing films from the nanometer scale up to several microns.
Wafers up to 200 mm.

Process temperture: up to 500 oC
PE power sourse for low temperature deposition (option - PEALD) 
Vacuum loak-lock (for SI ALD LL)
Process: Thermal ALD (Thermal ALD) and plasma ALD (PEALD)
SENTECH Software
ALD real time monitor
in-situ ellipsometer 
Cluster configuration
Glove box integration

Уже установлено в России и СНГ: 1 шт