SI 500 D from SENTECH Instruments GmbH - ICPECVD low temperature deposition system with vacuum load-lock.
The high end ICPECVD system SI 500 D provides exceptional performance for plasma based deposition processes. High quality dielectric and Si films are deposited using high density PECVD generated with the PTSA ICP plasma source. The planar triple spiral antenna (PTSA) ensures excellent properties of the deposited films, such as low etching rates, low stress and low interface state density at very low deposition temperatures (≤ 100 °C).
SI 500 D from SENTECH Instruments GmbH - ICPECVD low temperature deposition system with vacuum load-lock.
The high end ICPECVD system SI 500 D provides exceptional performance for plasma based deposition processes. High quality dielectric and Si films are deposited using high density PECVD generated with the PTSA ICP plasma source. The planar triple spiral antenna (PTSA) ensures excellent properties of the deposited films, such as low etching rates, low stress and low interface state density at very low deposition temperatures (≤ 100 °C).
SI 500 PPD form SENTECH Instruments GmbH - PECVD system woth vacuum load-lock.
The flexible PECVD system SI 500 PPD features a variety of standard plasma deposition processes. SiO2, SiNx, SiOxNy, and a-Si are deposited with capacitively coupled plasma. The flexible design allows to use gaseous or liquid precursors for PECVD like TEOS
Wafer up to 200 mm.
Vacuum load lock
Process: PECVD
Up to 8 gas limes
SENTECH Software
OES, laser interferometry, in-situ laser ellipsometer for process control
TEOS source
SI 500 PPD form SENTECH Instruments GmbH - PECVD system woth vacuum load-lock.
The flexible PECVD system SI 500 PPD features a variety of standard plasma deposition processes. SiO2, SiNx, SiOxNy, and a-Si are deposited with capacitively coupled plasma. The flexible design allows to use gaseous or liquid precursors for PECVD like TEOS
Wafer up to 200 mm.
Vacuum load lock
Process: PECVD
Up to 8 gas limes
SENTECH Software
OES, laser interferometry, in-situ laser ellipsometer for process control
TEOS source
Depolab 200 from SENTECH Instruments GmbH - PECVD open lid plasma deposition systems.
The PECVD system Depolab 200 combines cost effective direct loading and parallel plate plasma source in a basic, compact design. The easy to use direct loading system enables user-friendly batch processing (with carrier or direct loading onto the substrate electrode). The clever PECVD system can be upgraded for enhanced performance on demand.
Depolab 200 from SENTECH Instruments GmbH - PECVD open lid plasma deposition systems.
The PECVD system Depolab 200 combines cost effective direct loading and parallel plate plasma source in a basic, compact design. The easy to use direct loading system enables user-friendly batch processing (with carrier or direct loading onto the substrate electrode). The clever PECVD system can be upgraded for enhanced performance on demand.