SI 500 D from SENTECH Instruments GmbH - ICPECVD low temperature deposition system with vacuum load-lock.
The high end ICPECVD system SI 500 D provides exceptional performance for plasma based deposition processes. High quality dielectric and Si films are deposited using high density PECVD generated with the PTSA ICP plasma source. The planar triple spiral antenna (PTSA) ensures excellent properties of the deposited films, such as low etching rates, low stress and low interface state density at very low deposition temperatures (≤ 100 °C).
The SI 500 D features exceptional plasma properties like high density, low ion energy, and low pressure plasma deposition of dielectric films.
SENTECH proprietary Planar Triple Spiral Antenna (PTSA) ICP plasma source allows for highly efficient low power coupling.
Low etch rate, high breakdown voltage, low stress, no damage of substrate, and very low interface state density down to deposition temperatures of less than
The substrate electrode with dynamic temperature control in combination with He backside cooling and substrate backside temperature sensing provides excellent stable process conditions over a wide temperature range from room temperature up to
The SI 500 D plasma deposition tool represents the leading-edge for plasma enhanced chemical vapor deposition of dielectric films, a-Si, SiC, and other materials. It is based on PTSA plasma source, separated gas inlets for reaction gasses, dynamic temperature controlled substrate electrode, fully controlled vacuum system, advanced SENTECH control software using remote field bus technology, and a very user friendly general user interface for operating the SI 500 D.
A large variety of substrates from wafers up to
The SI 500 D plasma enhanced deposition tool is configured to deposit SiO2, SiNx, SiONx, and a-Si films in a temperature range from room temperature up to
SENTECH offers different levels of automation ranging from vacuum cassette loading to one process chamber up to six port cluster with different deposition and etch modules targeted to high flexibility or high throughput. The SI 500 D is available as process module on cluster configuration as well.
Request by email: info@minateh.ru