Maskless lithography

µMLA - table tor Maskless aligner from Heidelberg Instruments Mikrotechnik GmbH.

NEW: The table-top system µMLA features our state-of-the-art maskless technology and is the perfect entry-level tool for Research & Development, in virtually all areas that require microstructures. Typical examples are Microfluidics, Micro Optics, Sensors, MEMS, and Material Science. The µMLA is flexible and customizable like no other table-top direct writing tool before and supports the use of millimeter-sized samples.

• Substrate size: from 5 mm to 5”
• Minimum feature size: down to 0.6 µm
• Maximum write speed (at 4 µm resolution): 200 mm2/min
• Real-time autofocus system
• Frontside alignment
• Easy-to-use operating software
• 2 available optical setups
• Choice of exposure Module: Raster and/or Vector scan
• Variable resolution
• Draw Mode
• Wavelengths (Raster Scan): 390 nm or 365 nm exposure wavelength
• Wavelengths (Vector Scan): 405 nm and/or 375 nm
• Overview camera for alignment and inspection

Maskless Aligner MLA150 производства Heidelberg Instruments Mikrotechnik GmbH.

Non-contact exposure, outstanding ease of use, and high speed make the Maskless Aligner MLA150 the ideal tool in rapid prototyping environments, for low- to mid-volume production, and in Research & Development. Our once revolutionary, now state-of-the-art maskless technology has become firmly established since our Maskless Aligner series was first introduced in 2015. The MLA150 now presents the modern-day alternative to the traditional Mask Aligner.

• Minimum substrate size: 3 mm x 3 mm
• Maximum exposure area: 6” x 6” (optional 8”x 8”)
• Minimum structure size down to 0.6 μm
• Maximum write speed: 1400 mm2/min at 1 μm feature size
• Real-time autofocus
• Overview camera for fast alignment and inspection
• Front- and backside alignment
• Temperature-controlled environmental chamber
• Exposure wavelengths: 405 nm and / or 375 nm
• Draw Mode for CAD-less exposure
• Standard Grayscale Exposure Mode
• High-Aspect Ratio Mode
• Easy-to-use operating software

DWL 66+ laser lithography system from Heidelberg Instruments Mikrotechnik GmbH.

The DWL 66+ laser lithography system is an economical, high-resolution pattern generator for direct writing. The system features powerful options such as front- and backside alignment and a choice of 405 nm or 375 nm laser wavelength. Further advanced options include an absolute position calibration and an automatic loading system. A total of six different Write Modes are available, amongst them the High-Resolution Mode with a resolution of 300 nm.

• Maximum exposure area: 200 x 200 mm²
• Maximum substrate size: 9" x 9"
• Multiple Write Modes
• Minimum feature size: down to 300 nm
• Maximum write speed (at 4 µm feature size): 2000 mm²/min
• Address grid down to 5 nm
• Grayscale exposure mode with up to 1000 gray levels
• Vector and Raster scan exposure mode
• Multiple data input formats
• Front- and backside alignment
• Climate chamber
• Two choices of laser wavelength (405 nm or 375 nm)
• Real-time autofocus system
• Scripting capability
• Integrated camera system for measurement and inspection

DWL 2000 and 4000 laser lithography from Heidelberg Instruments Mikrotechnik GmbH.

The DWL 2000 and 4000 laser lithography systems constitute fast, flexible high-resolution pattern generators, capable of the Professional performance level of Grayscale Lithography. The latter allows the creation of complex 2.5D structures in thick photoresist over large areas. Most common applications of the Grayscale exposure mode include the fabrication of wafer level optics used for telecommunication or illumination market segments; it is also used in display manufacturing, and in device fabrication in Biology and the Life Sciences.

• Maximum exposure area: up to 400 x 400 mm²
• Maximum substrate size: 17" x 17"
• Professional Grayscale Mode
• Multiple Write Modes
• Minimum feature size down to 0.5 µm
• Maximum exposure speed (at 1.3 µm feature size): 370 mm²/ minute
• Address grid down to 5 nm
• Modular configuration concept to fit customer application
• Realtime autofocus
• Stage map correction
• Camera system for measurement and inspection
• Automatic loading system
• Customer specific laser
• Multiple data input formats (DXF, CIF, GDSII, Gerber, STL, BMP)

VPG+ 200/ VPG+ 400 - multi-Purpose Volume Pattern Generators from Heidelberg Instruments Mikrotechnik GmbH (Германия).
VPG+ - High Speed Pattern Generators. 

Our Multi-Purpose Volume Pattern Generators are perfectly suited for the production of standard photomasks as well as for i-line resist applications. An ultra-high-speed exposure engine and automated alignment capability both contribute to systems that excel through high resolution, outstanding image quality, and fast throughput.

• Maximum substrate size: 8” (VPG+ 200) and 16” (VPG+ 400) respectively
• Minimum feature size: Down to 0.75 μm
• Address grid: Down to 12.5 nm
• Maximum write speed (at structure size 4 um): 13500 mm2/min
• Exchangeable write modes
• Real-time autofocus system
• High power DPSS laser with 355 nm wavelength
• Camera system for metrology and alignment
• Closed-loop climate chamber
• Automatic substrate loading system
• Stage map correction
• Edge detector system
• Multiple data input formats (DXF, CIF, GDSII and Gerber)

ULTRA - Semiconductor Laser Mask Writer from Heidelberg Instruments Mikrotechnik GmbH (Германия).

The ULTRA specifically addresses the production of mature semiconductor photomasks. It provides an economical mask writer solution with all the features you require for high throughput, high precision and structure uniformity, and extremely accurate alignment. With its modern, compact build, you can easily incorporate the system into an existing mask shop infrastructure.

• Maximum substrate size: 9" x 9"; optional: 17" x 17"
• Minimum feature size: 500 nm
• Address grid down to 5 nm
• High-speed optical engine
• Customized UV optics (0.9 NA objective lens)
• 20 nm line edge roughness
• Input formats: All standard formats, e.g. GDSII, OASIS
• Overlay of 30 nm
• Economical, high-power UV laser
• 100 nm 2nd layer alignment
• Automatic mask loader
• CD uniformity of 30 nm
• SECS / GEM protocol
• High-speed data path for all types of pattern

MLA300 - Maskless Aligner for Volume Production from Heidelberg Instruments Mikrotechnik GmbH

The MLA300 is the industrial production version of the Maskless Aligner, which already has become a standard in Research & Development applications, rapid prototyping, and low-to mid-volume production. The MLA300 achieves high resolutions of 2 µm lines and spaces at the high throughput and high availability expected in production. It features full automation with wafer robot and load ports, and software specifically designed for the production environment to offer a simplified automated workflow.

• Maximum exposure area: 300 mm x 300 mm
• Minimum feature size: 1.5 μm
• Minimum lines and spaces: 2 µm
• Maximum write speed: 5000 mm2/min (at 405 nm, with one module)
• Real-time autofocus
• Overview camera for fast alignment and inspection
• Front- and backside alignment
• Temperature-controlled environmental chamber
• Exposure wavelengths: 405 nm and / or 375 nm