Maskless Aligner MLA150 производства Heidelberg Instruments Mikrotechnik GmbH.

Non-contact exposure, outstanding ease of use, and high speed make the Maskless Aligner MLA150 the ideal tool in rapid prototyping environments, for low- to mid-volume production, and in Research & Development. Our once revolutionary, now state-of-the-art maskless technology has become firmly established since our Maskless Aligner series was first introduced in 2015. The MLA150 now presents the modern-day alternative to the traditional Mask Aligner.

Maskless photolithography eliminates the need for a photomask: The system exposes the pattern directly onto the resist-covered surface. Should design modifications be required, these can be quickly implemented by changing the CAD layout, resulting in much-reduced cycle-times. You will also benefit from a fast, automated front- and backside alignment procedure as well as the outstanding speed: Exposing an area of 100 x 100 mm² with structures as small as 1 micron will take less than 10 minutes. The application areas of the MLA150 include life sciences, MEMS, micro-optics, semiconductors, sensors, actuators, MOEMS, material research, nano-tubes, and graphene.

Key Features MLA150

• Minimum substrate size: 3 mm x 3 mm
• Maximum exposure area: 6” x 6” (optional 8”x 8”)
• Minimum structure size down to 0.6 μm
• Maximum write speed: 1400 mm2/min at 1 μm feature size
• Real-time autofocus
• Overview camera for fast alignment and inspection
• Front- and backside alignment
• Temperature-controlled environmental chamber
• Exposure wavelengths: 405 nm and / or 375 nm
• Draw Mode for CAD-less exposure
• Standard Grayscale Exposure Mode
• High-Aspect Ratio Mode
• Easy-to-use operating software