µMLA - Table tor Maskless Aligner

µMLA - table tor Maskless aligner from Heidelberg Instruments Mikrotechnik GmbH.

NEW: The table-top system µMLA features our state-of-the-art maskless technology and is the perfect entry-level tool for Research & Development, in virtually all areas that require microstructures. Typical examples are Microfluidics, Micro Optics, Sensors, MEMS, and Material Science. The µMLA is flexible and customizable like no other table-top direct writing tool before and supports the use of millimeter-sized samples.

Select the exposure mode you need or even equip your µMLA with both: The Raster Scan Exposure Module provides fast exposure with a speed independent of design complexity. The Vector Module exposes continuous curves, creating smooth contours vital for applications such as waveguides. In addition, the µMLA offers a choice of 2 optical setups with different ranges of throughput and variable resolution. Within your optical setup the software allows easy switching between three configurations, optimizing resolution and speed according to your requirements.

KEY FEATURES

Substrate size: from 5 mm to 5”
Minimum feature size: down to 0.6 µm
Maximum write speed (at 4 µm resolution): 200 mm2/min
Real-time autofocus system
Frontside alignment
Easy-to-use operating software
2 available optical setups
Choice of exposure Module: Raster and/or Vector scan
Variable resolution
Draw Mode
Wavelengths (Raster Scan): 390 nm or 365 nm exposure wavelength
Wavelengths (Vector Scan): 405 nm and/or 375 nm
Overview camera for alignment and inspection

Working principles

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Perameters µMLA

Parameters	WM I *	WM II *	WM III *
Writing performance (both Raster Scan and Vector Exposure Module)
Minimum structure size [μm]	0,6	1,0	2,0
Minimum lines and spaces [half pitch, μm]	0,8	1,5	3,0
2nd layer alignment over 5 x 5 mm2 [3σσ, nm]	500	500	500
2nd layer alignment over 50 x 50 mm2 [3σσ, nm]	1000	1000	1000
Writing performance with the Raster Scan Exposure Module
Line width variation [3σ, nm]	200	300	400
Max. write speed [mm2/min]	10	30	50
Write speed with optional “Variable Resolution for Raster Scan Exposure Module” (UMVAR) for different minimum structure sizes	10 mm²/min at 0.6 µm	30 mm²/min at 1 µm	50 mm²/min at 2 µm
	20 mm²/min at 1 µm	60 mm²/min at 2 µm	100 mm²/min at 4 µm
	25 mm²/min at 2 µm	100 mm²/min at 4 µm	200 mm²/min at 6 µm
Writing performance with the Vector Exposure Module
Address grid in vector mode [nm]	20
Edge roughness [3σσ, nm]	30	50	80
Line width variation [3σσ, nm]	70	80	130
Maximum linear write speed	200
System specifications
Maximum substrate size	5" х 5"
Minimum substrate size	5 мм х 5 mm
Substrate thickness	0,1 - 12 mm
Maximum write area	100 mm х 100 mm
	Raster scan exposure module		Vector exposure module
Light source	LED: 390 nm or 365 nm		Laser: 405 nm and/or 375 nm
System dimensions (lithography unit)
µMLA	Width	Depth	Height	Weidht
Main system housing	630 mm	800 mm	530 mm	100 kg
Optional antivibrational table plus user PC table	1400 mm	700 mm	750 mm	350 rg
Installation requirements
Electrical	230 VAC ± 5%, 50/60 Hz, 16A
Compressed air	6 - 10 bar, stability ± 0.5 bar

* Only one write mode can be installed on the system

Video MLA

Send request by email: info@minateh.ru

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