DWL 66+ laser lithography system from Heidelberg Instruments Mikrotechnik GmbH.

The DWL 66+ laser lithography system is an economical, high-resolution pattern generator for direct writing. The system features powerful options such as front- and backside alignment and a choice of 405 nm or 375 nm laser wavelength. Further advanced options include an absolute position calibration and an automatic loading system. A total of six different Write Modes are available, amongst them the High-Resolution Mode with a resolution of 300 nm. Notably, the DWL 66+ presents the ultimate performance in Grayscale exposure mode, from Standard to Professional levels: This versatile technique for the creation of complex 2.5D microstructures in thick layers of low-contrast positive photoresists is used for applications such as micro-lenses, DOEs, holograms (CGHs), and textured surfaces.

This highly flexible and customizable system can be specifically tailored to your application – the sophisticated capabilities of the DWL 66+ make it the essential lithography research tool in Life Science, Advanced Packaging, MEMS, Micro-Optics, Semiconductor and all other applications that require microstructures.

KEY FEATURES

• Maximum exposure area: 200 x 200 mm²
• Maximum substrate size: 9" x 9"
• Multiple Write Modes
• Minimum feature size: down to 300 nm
• Maximum write speed (at 4 µm feature size): 2000 mm²/min
• Address grid down to 5 nm
• Grayscale exposure mode with up to 1000 gray levels
• Vector and Raster scan exposure mode
• Multiple data input formats
• Front- and backside alignment
• Climate chamber
• Two choices of laser wavelength (405 nm or 375 nm)
• Real-time autofocus system
• Scripting capability
• Integrated camera system for measurement and inspection