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DWL 2000 and 4000 laser lithography

DWL 2000 and 4000 laser lithography from Heidelberg Instruments Mikrotechnik GmbH.

The DWL 2000 and 4000 laser lithography systems constitute fast, flexible high-resolution pattern generators, capable of the Professional performance level of Grayscale Lithography. The latter allows the creation of complex 2.5D structures in thick photoresist over large areas. Most common applications of the Grayscale exposure mode include the fabrication of wafer level optics used for telecommunication or illumination market segments; it is also used in display manufacturing, and in device fabrication in Biology and the Life Sciences.

In addition to Grayscale, the DWL series tools excel at binary 2D exposures, down to the highest resolution with a minimum feature size of 500 nm. With a write area of up to 400 mm x 400 mm and the optional automatic loading system, these systems provide the perfect solution if you require high-throughput patterning of masks and wafers in MEMS, BioMEMS, Micro Optics, ASICs, Micro Fluidics, Sensors, and CGHs.

KEY FEATURES

  • Maximum exposure area: up to 400 x 400 mm²
  • Maximum substrate size: 17" x 17"
  • Professional Grayscale Mode
  • Multiple Write Modes
  • Minimum feature size down to 0.5 µm
  • Maximum exposure speed (at 1.3 µm feature size): 370 mm²/ minute
  • Address grid down to 5 nm
  • Modular configuration concept to fit customer application
  • Realtime autofocus
  • Stage map correction
  • Camera system for measurement and inspection
  • Automatic loading system
  • Customer specific laser
  • Multiple data input formats (DXF, CIF, GDSII, Gerber, STL, BMP)
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Parameters

Write Mode I II III IV
Address Grid [nm]   5    10   12,5   25 
Minimum Structure Size [µm] 0,5 0,7 0,8 1,3
Max. Exposure Speed [mm2 /minute] 29 110 - -
Edge Roughness [3σ,nm] 40 50 60 80
CD Uniformity [3σ,nm] 60 80 90 120

Overlay Accuracy [3σ,nm]

160 200 225 350

Alignment measurement accuracy (3σ), нм

60 70 90 140

Requested by email: info@minateh.ru