New MDA-80MS from MIDAS SYSTEM (Korea) - Semi-automatic Mask Aligner.
Easy operation & Installation , PLC Operation with PC control , Compact size semi auto system , Image grab & Data log , More than 100 Program recipes
- BSA with CCD camera (Option)
- Wafer up to 200 mm
- Nanoimprint (Option)
- Semi-Automatic Stage moving during focus anf alignment, Auto Exposure.
Specification
- Type - PC control semi auto
- Mask size - up to 9 inch
- Substrate size - piece to 8 inch
- Uniform beam size - 8.25 * 8.25 inch
- UV light source - UV Lamp, 1 kW
- Beam wavelength - 350 ~ 450 nm
- Beam uniformity - <±5 %
- 365 nm intensity - ~ 25 mW/㎠
- Alignment method - manual
- Alignment accuracy - 1 um
- Process mode - Soft, Hard, Vacuum contact & Proximity
- Process resolution - 1 um @ 1 um PR thickness with vacuum contact
- Dimensions (mm)1400(W) * 1100(D) * 1600(H)
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