HFB-System High Flexible Die Bonder System from Paroteq GmbH (Германия).
Semi-automatic Die Bonder-System in rigid granite frame arrangement with a high bond force capability, second z - axis and a beam splitter optics for accurate alignment.
- Bond force up to 1000N
- Second z - axis
- HMTPA (high magnified two point alignment)
- Free pogrammable automated bond process
- Network ready (RDS)
- Cycle time <5 sec.
The HFB-System is a versatile Die Bonder-System designed for micro assembly applications like diffusion bonding or high contact density flip chip bonding. With the integrated dual imaging optics in combination with the programmable Z-axis this system is well suited for reproducible bonding of electronic and opto-electronic components. A physically generated overlay live image allows the operator in combination with a user friendly program interface to intuitively perform the component alignment and bonding. A second Z-axis can be used for load or unload of single or bonded devices, dispensing, dipping or stamping without tool exchange. This arrangement guarantees a maximum of stability at high bond forces as well as a maximum working range using minimal footprint. Available options such as different heating plates, heated pick up tools, ultrasonic module or dispenser further extend the usability of the system. The HFB-system supports all topical and future connecting technologies and applications in the area of micro systems technology.
Applications
- sinter / diffusion bonding
- high contact density Flip Chip Bonding
- CoS (chip on Submount)
- MEMS / MOEMS assembly
- sensor assembly
- assembly of optical components (photo diodes, laser diodes)
- assembly of lenses and lens arrays
- laserbar bonding
- wafer bonding
- assembly of mechanical components
- sorting of components
- assembly of medical parts
Technologies
- thermo-compression bonding (eutectic bonding, Au/Au bonding, Au/Sn bonding, Cu/Cu bonding)
- ultrasonic - or thermosonic bonding
- adhesive bonding
- dispensing
- dipping
- stamping
- UV curing
Options
- HMTPA (high magnified two point alignment)
- different light sources
- ultrasonic module
- dispensing / stamping
- UV-curing
- heated pick-up tools
- heating plates with and w/o vacuum structure
- Coplanarity tools
- process gas chamber
- process gas suction
- support plate with vacuum
- input-/output station with or without vacuum
- HD inspection camera
Technical specifications
- rigid granite frame arrangement
- beam splitter optics
- fully programmable bond process
- air cushion table with micrometer screws for x- and y-axis
- levelable and height adjustable bond stage
- HD camera with optical zoom
- bond force: 0.1 - 1000N
- positioning accuracy: 3 micron
- maximum component size 25mm x 25mm
- maximum substrate size 175mm x 175mm
- working area: 175mm x 150mm
- open frame for process gas suction
