HFB-system PRE Versatile automatic Die Bonder-System from Paroteq GmbH.
Versatile automatic Die Bonder-System with granite table on steel frame for changing lot sizes.
The HFB-System PRE represents the latest development stage of the HFB-System. With this development an important milestone towards full automation and reproducibility for our pick and place systems was achieved.
In this configuration, the positioning of the components is exclusively motorized and controlled by the well-known Pattern Recognition System from Cognex. Depending on the presentation, the components to be assembled can be processed individually or in series.
- Fully automated
- Small footprint
- Immediately productive
- Versatile use
- Cycle time <5 sec.
Applications
- Die bonding
- Flip Chip Bonding
- CoS (chip on Submount)
- MEMS / MOEMS assembly
- sensor assembly
- assembly of optical components (photo diodes, laser diodes)
- assembly of lenses and lens arrays
- Laser bar bonding
- assembly of mechanical components
- sorting of components
- assembly of medical parts
Technologies
- thermo-compression bonding (eutectic bonding, Au/Au bonding, Au/Sn bonding)
- ultrasonic - or thermosonic bonding
- adhesive bonding
- dispensing
- dipping
- stamping
- UV curing
Options
- HMTPA (high magnified two point alignment)
- different light sources
- dispensing / stamping
- UV-curing
- heated pick-up tools
- heating plates with and w/o vacuum structure
- Coplanarity tools
- process gas chamber
- process gas suction
- support plate with vacuum
- input-/output station with or without vacuum
- up to four cameras
- height adjustable bond stage
Technical specifications
- granite table with x, y and theta stage on steel frame
- beam splitter optics
- freely adjustable assembly process
- bond force: 10 - 500cN
- positioning accuracy: 1 micron
- maximum component size 25mm x 25mm
- maximum substrate size 150mm x 200mm
- foot print: 1200mm x 800mm x 1400mm
