Double side photoresist spray coater (MEMS) from CND PLUS (Ю. Корея).
The automatic installation provides spray application of the photoresist on the upper and / or lower sides of the wafer with a diameter of up to 200 mm in one loading cycle.
Application: MEMS and others.
This system is used in many kinds of special coating process including MEMS process and includes both coating function of top/back side.
Product Facts
- Flexible modular design
- High throughput
- Robot (wafers loader) of own production
- Installation includes:
- Photoresist application module (spray coater)
- Photoresist backing Module (Hot plate)
- Cooling plate module
- Setting wafer pre alignment (pre aligner unit)
- Wafer position control device
- Robot with without contact with the surface of the wafer (non contact arm)
- High uniformity across the wafer
- High wafer-to-wafer process reproducibility
- Convenient and intuitive software for working with the system and creating ready-made recipes
- Compact architecture with robot and cassettes
- Short delivery times and low cost