The plasma etching system EtchLab 200 features the benefits of cost effective direct loading for RIE.
The EtchLab 200 allows easy and quick sample loading for batch processing on carriers or direct loading onto the electrode. Small footprint, modularity and flexibility are design features of RIE plasma etching system
Cost-effectiveness
RIE plasma etcher Etchlab 200 combines parallel plate plasma source design with direct load.
Upgradeability
According to its modular design, the plasma etcher Etchlab 200 is upgradeable with larger pumping unit,
vacuum load lock, and additional gas lines.
SENTECH control software
This plasma etcher is equipped with a user-friendly powerful software with mimic GUI, parameter window, recipe editor, data logging, user management.
The Etchlab 200 RIE plasma etcher represents a family of direct load plasma etcher combining the advantages of a parallel plate electrode design for RIE with the cost effective design of direct load. The Etchlab 200 features simple and fast sample loading from parts to 200 mm or 300 mm diameter wafer directly onto the electrode or on carrier. Flexibility, modularity, and a small footprint are design characteristics of the Etchlab 200. Large diagnostic windows located at the top electrode and the reactor can easily accommodate the SENTECH laser interferometer or OES and RGA systems. Ellipsometer ports are available for process monitoring using SENTECH insitu ellipsometers.The Etchlab 200 plasma etcher can be configured for processing of materials that are compatible with wafer direct loading, including but not limited to silicon and silicon compounds, compound semiconductors, dielectrics, and metals.The Etchlab 200 is operated by the advanced SENTECH control software using remote field bus technology and a very user-friendly general user interface.
Short data
- RIE plasma etcher
- Open lid
- For up to 200 mm wafers
- Diagnostic windows for laser interferometer and OES
- Ellipsometer ports optionally available
